IWATE University  Faculty of Science and Engineering  Department of Chemistry and Biological Science  Studies in Chemistry 


Associate Professor

Laboratory Address


Laboratory Phone number


Mail Address

E-mail address

Graduate School 【 display / non-display


    Iwate University  Graduate School, Division of Engineering  Frontier Materials and Function Engineering  Doctor's Course  Completed


    Others  Graduate School, Division of Engineering  Master's Course  Completed

Degree 【 display / non-display

  • Iwate University -  Doctor(Engineering)  2012.09.23

Campus Career 【 display / non-display

  • 2022.04

    IWATE University   Center for Hiraizumi Studies   Associate Professor   [Concurrently]

  • 2020.04

    IWATE University   Faculty of Science and Engineering   Department of Chemistry and Biological Science   Studies in Chemistry   Associate Professor   [Duty]

  • 2020.04

    IWATE University   Center for Hiraizumi Studies   Associate Professor   [Concurrently]

Research Areas 【 display / non-display

  • Nanotechnology/Materials / Composite materials and interfaces


Course Subject 【 display / non-display

  • 2020

    Chemistry and Bioengineering Laboratory 1

  • 2020

    "Exercises in Chemistry

  • 2021

    Graduation Research

  • 2021

  • 2021

    Basic Seminar for the first-year students

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Published Papers 【 display / non-display

  • Chemical Interaction at the Interface of Metal-Resin Bonding

      35 ( 9 ) 290 - 294   2023.09  [Refereed]

    Academic Journal  Multiple authorship

  • Submicrometer analyses of the polymer flow modifier effects on metal–polymer direct joining

    Shuohan Wang, Fuminobu Kimura, Weiyan Chen, Jing Sang, Hidetoshi Hirahara, Yusuke Kajihara

    Materials Letters   347 ( 134655 )   2023.06  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    Polymer modification is a promising approach to improve the joining performance of injection molded direct joining (IMDJ) technology. However, the factors contributing to the improved joining strength of submicron scale surface pattern joints have not been fully elucidated. In this study, we investigated the mechanism for improving the joining performance of polyamide 6 (PA6)/aluminum alloy A5052 joints with Blast + hot water treated metal structure using a flow modifier (OSGOL MF-11). Enhanced mechanical polymer infiltration at the submicron scale was confirmed, and the hydrogen bond generation at the joint interface was characterized. These findings elucidate the reason for the joining performance improvement caused by the flow modifier in the submicron scale.

  • Superhydrophobic coatings by electrodeposition on Mg–Li alloys: Attempt of armor-like Ni patterns to improve the robustness

    Hongyuan He, Jiebin Du, Jing Sang, Hidetoshi Hirahara, Sumio Aisawa, Dexin Chen

    Materials Chemistry and Physics   304 ( 127902 )   2023.05  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    Due to the fragility of the layered structure, the mechanical properties of superhydrophobic surfaces, particularly wear resistance, are still too poor, limiting the industrial application of protecting magnesium-lithium (LZ91) alloys from corrosion. As a result, we’re testing screen-printed masks to electroplate armor-like Ni columns. Then, using electrodeposition, compact micro/nanometer-sized papillary structured superhydrophobic surfaces are created on Mg–Li alloys, which exhibit good low viscosity, self-cleaning, chemical stability, and excellent corrosion resistance with a 2 order of magnitude decrease in corrosion current density in both corrosive media. Surprisingly, increasing the deposition time causes the dissolution of Cu anode electrodes and the subsequent formation of Cu compounds on the superhydrophobic coating, resulting in the formation of dense needle-like structures on these papillae. Even after the superhydrophobic structures are worn away, the armor-like Ni col- umns reduce the contact angle’s tendency to decrease. This proposed deposition method provides a simple and fast process for protecting the surface of Mg–Li alloys, and the concept of armored Ni patterns may pave the way for future advances in the robustness and application of superhydrophobic coatings.

  • Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

    Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma

    Composites. Part B. Engineering   254 ( 110562 )   2023.01  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    The fast development of electric vehicles promoted the development of next-generation power modules. Along with this trend, the encapsulation techniques are also transforming from previous gel encapsulation to epoxy encapsulation because epoxy encapsulation reduces the module size significantly. However, the dissimilar bonding between the epoxy and the metal substrate is a weak part of the entire module. Unlike previous studies, which focused on epoxy properties and thermal stress, we investigated the failure mechanisms between the encapsulation epoxy and the copper substrate under high temperatures by considering the interfacial interaction. A high-temperature storage test (HST) was performed at 200 .DEG.C until 1000 h for encapsulated packages. We then measured the bonding strength and identified the fracture path at the nanoscale by SEM, XPS, and ToF-SIMS depth profiling. In addition, the changes in the epoxy were characterized by ATR-FTIR, nanoindentation, and XPS depth profiling. The bonding interface was analyzed with AFM-IR, SEM, EDS, and STEM. We found that the fracture happened inside the epoxy rather than the copper/epoxy interface. More importantly, we found that copper atoms diffused into the epoxy reaching approximately 100 nm. The diffused copper atoms and the long-time high-temperature heating promoted the epoxy pyrolysis, forming a 100 nm thick weak layer at the epoxy side, which is the key reason for the high-temperature failure. Our study provided a fresh understanding of the failure mechanisms of the bonding between encapsulation epoxy and the copper substrate under HST, which will contribute significantly to future power module design and material development. Copyright 2023 Elsevier B.V., Amsterdam.All rights reserved.


  • Preparation of hollow nanosphere of 5-fluorouracil/layered double hydroxide and its cellular cytotoxicity

    Sumio Aisawa, Jing Sang, Daisuke Suga, Hidetoshi Hirahara, Eiichi Narita

    Applied clay science   226   106575   2022.09  [Refereed]

    Academic Journal  Multiple authorship

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Books 【 display / non-display

  • Surface Modification Technologies for Polymer Materials


    Scholarly Book

Academic Awards Received 【 display / non-display

  • 2021.09.14