HIRAHARA Hidetoshi

写真a

Affiliation

IWATE University  Faculty of Science and Engineering  Department of Chemistry and Biological Science  Studies in Chemistry 

Position

Professor

Laboratory Phone number

+81-19-621-6333

Laboratory Fax number

+81-19-621-6333

Mail Address

E-mail address

Research Interests 【 display / non-display

  • Adhesion

  • Rubber

  • Interface Surface chemistry

  • Inorganic organic composite materials

  • Release

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Graduating School 【 display / non-display

  •  
    -
    1985.03

    Iwate University   Faculty of Engineering   Other

Degree 【 display / non-display

  • Yamagata University -  Doctor (Engineering)  1998.03

Campus Career 【 display / non-display

  • 2020.04
    -
    Now

    IWATE University   Center for Hiraizumi Studies   [Concurrently]

  • 2018.04
    -
    2020.03

    IWATE University   Center for Hiraizumi Studies   [Concurrently]

  • 2016.04
    -
    Now

    IWATE University   Faculty of Science and Engineering   Department of Chemistry and Biological Science   Studies in Chemistry   Professor   [Duty]

  • 2016.04
    -
    Now

    IWATE University   Abolition organization   Organization of Revitalization for Sanriku-region and regional development   Professor   [Concurrently]

  • 2014.03
    -
    2019.03

    IWATE University   Graduate School of Engineering(Advanced Doctoral Programs)   Frontier Matter and Function Engineering   Professor   [Concurrently]

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Research Areas 【 display / non-display

  • Nanotechnology/Materials / Organic functional materials

  • Polymer chemistry

  • Nanotechnology/Materials / Nano/micro-systems

  • Nanotechnology/Materials / Analytical chemistry

  • Adhesion

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Course Subject 【 display / non-display

  • 2004

    Seminar in Chemical Engineering

  • 2004

    Chemical Engineering Laboratory Ⅰ

  • 2004

    Chemical Engineering Exercise Ⅰ

  • 2004

    Information for Chemistry

  • 2004

    Industrial Analytical Chemistry

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Research Career 【 display / non-display

  • Research and development of innovative manufacture using molecular adhesion technology

    Periods of research:

    2014.06
    -
    Now

    Keywords : JUNCTION ADHESION SIP

    Style of Research: Collaboration in Japan

    Research Program: Research for Technical Practical Use Promotion of Leading  

    Contents of Research Career

    ・In the wide fields of industries such as vehicles, airplanes, semiconductor electrical equipments, medical equipment etc., the development of novel composite materials are in great competition now. The adhesion technology of different materials is becoming increasingly important.
    ・IWATE University has developed the method named “molecule adhesion technology by triazine derivative" which has the advantages such as material, condition and environment independence. It can be proposed as a new manufacture technology to realize fewer components and processes integration.
    ・With the advancement and diffusing of this technology promoting, the development can be performed for creating plenty of new functional products. The East-Japan post-earthquake rehabilitation and the innovation of manufacture of Japan will be expected.

  • Intercalation of Triazinethiol Molecules into Layered Double Hydroxide and Their Crosslinking Property for Halogenated Rubber Intercalation of Triazinethiol Molecules into Layered Double Hydroxide and Their Crosslinking Property for Halogenated Rubber Intercalation of Triazinethiol Molecules into Layered Double Hydroxide and Their Crosslinking Property for Halogenated Rubber

    Periods of research:

    1999.04
    -
    Now

    Keywords : Layered double hydroxide

    Research Program: (not selected)  

  • DISSIMILAR METALS JUNCTION and ADHESION

    Periods of research:

    1994.04
    -
    Now

    Keywords : JUNCTION and ADHESION

    Style of Research: Collaboration in Japan

    Research Program: The Other Research Programs  

  • New triazine thiols compound synehesis

    Periods of research:

    1992.04
    -
    Now

    Keywords : triazine thiol

    Style of Research: Collaboration in Japan

    Research Program: (not selected)  

  • Direct adhesion between Metal and Rubber

    Periods of research:

    1992.04
    -
    Now

    Keywords : metal,rubber,adhesion

    Style of Research: Individual

    Research Program: (not selected)  

Published Papers 【 display / non-display

  • Submicrometer analyses of the polymer flow modifier effects on metal–polymer direct joining

    Shuohan Wang, Fuminobu Kimura, Weiyan Chen, Jing Sang, Hidetoshi Hirahara, Yusuke Kajihara

    Materials Letters   347 ( 134655 )   2023.09  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    Polymer modification is a promising approach to improve the joining performance of injection molded direct joining (IMDJ) technology. However, the factors contributing to the improved joining strength of submicron scale surface pattern joints have not been fully elucidated. In this study, we investigated the mechanism for improving the joining performance of polyamide 6 (PA6)/aluminum alloy A5052 joints with Blast + hot water treated metal structure using a flow modifier (OSGOL MF-11). Enhanced mechanical polymer infiltration at the submicron scale was confirmed, and the hydrogen bond generation at the joint interface was characterized. These findings elucidate the reason for the joining performance improvement caused by the flow modifier in the submicron scale.

  • Superhydrophobic coatings by electrodeposition on Mg–Li alloys: Attempt of armor-like Ni patterns to improve the robustness

    Hongyuan He, Jiebin Du, Jing Sang, Hidetoshi Hirahara, Sumio Aisawa, Dexin Chen

    Materials Chemistry and Physics   304 ( 127902 )   2023.05  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    Due to the fragility of the layered structure, the mechanical properties of superhydrophobic surfaces, particularly wear resistance, are still too poor, limiting the industrial application of protecting magnesium-lithium (LZ91) alloys from corrosion. As a result, we’re testing screen-printed masks to electroplate armor-like Ni columns. Then, using electrodeposition, compact micro/nanometer-sized papillary structured superhydrophobic surfaces are created on Mg–Li alloys, which exhibit good low viscosity, self-cleaning, chemical stability, and excellent corrosion resistance with a 2 order of magnitude decrease in corrosion current density in both corrosive media. Surprisingly, increasing the deposition time causes the dissolution of Cu anode electrodes and the subsequent formation of Cu compounds on the superhydrophobic coating, resulting in the formation of dense needle-like structures on these papillae. Even after the superhydrophobic structures are worn away, the armor-like Ni col- umns reduce the contact angle’s tendency to decrease. This proposed deposition method provides a simple and fast process for protecting the surface of Mg–Li alloys, and the concept of armored Ni patterns may pave the way for future advances in the robustness and application of superhydrophobic coatings.

  • Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

    Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma

    Composites. Part B. Engineering   254 ( 110562 )   2023.01  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    The fast development of electric vehicles promoted the development of next-generation power modules. Along with this trend, the encapsulation techniques are also transforming from previous gel encapsulation to epoxy encapsulation because epoxy encapsulation reduces the module size significantly. However, the dissimilar bonding between the epoxy and the metal substrate is a weak part of the entire module. Unlike previous studies, which focused on epoxy properties and thermal stress, we investigated the failure mechanisms between the encapsulation epoxy and the copper substrate under high temperatures by considering the interfacial interaction. A high-temperature storage test (HST) was performed at 200 .DEG.C until 1000 h for encapsulated packages. We then measured the bonding strength and identified the fracture path at the nanoscale by SEM, XPS, and ToF-SIMS depth profiling. In addition, the changes in the epoxy were characterized by ATR-FTIR, nanoindentation, and XPS depth profiling. The bonding interface was analyzed with AFM-IR, SEM, EDS, and STEM. We found that the fracture happened inside the epoxy rather than the copper/epoxy interface. More importantly, we found that copper atoms diffused into the epoxy reaching approximately 100 nm. The diffused copper atoms and the long-time high-temperature heating promoted the epoxy pyrolysis, forming a 100 nm thick weak layer at the epoxy side, which is the key reason for the high-temperature failure. Our study provided a fresh understanding of the failure mechanisms of the bonding between encapsulation epoxy and the copper substrate under HST, which will contribute significantly to future power module design and material development. Copyright 2023 Elsevier B.V., Amsterdam.All rights reserved.

    DOI

  • Hydrophilicity Enhancement of Copper Surface with Oligo(2-methyl-2-oxazoline) Having a Triazinethiol Moiety on Oligomer End

    J.Jpn.Soc.Colur Mater.   95 ( 8 ) 229 - 234   2022.08  [Refereed]

    International Conference Proceedings  Single Work

    DOI

  • Preparation of hollow nanosphere of 5-fluorouracil/layered double hydroxide and its cellular cytotoxicity

    Sumio Aisawa , Jing Sang , Daisuke Suga , Hidetoshi Hirahara , Eiichi Narita

    Applied Clay Science   226 ( 106575 )   2022.06  [Refereed]

    Bulletin of University, Institute, etc.  Multiple authorship

    We have first prepared the layered double hydroxide (LDH)/carbon nanosphere (CNS) composite by mixing the LDH gel containing methoxide interlayer anion with the CNS template (particle size of 300-700 nm) suspension in methanol at room temperature under ultrasonication. The SEM observation indicates that the CNS core was uniformly covered with the LDH thin film made up by fine plate-like particles to form the composite. Then, the intercalation of anticancer drug, 5-fluorouracil (5-FU), into the LDH interlayer was carried out by the calcination-rehydration reaction and the solid products were analyzed using XRD, FT-IR, SEM, TEM etc. During the calcination process at 500 .DEG.C for 3 h, the CNS core was removed by combustion and the LDH shell became the hollow LDH oxide nanosphere. In the following rehydration process at 60 .DEG.C for 24 h, this oxide precursor was reconstructed the hollow LDH nanosphere having the surface of coral-like structure (spontaneously formed LDH particles) incorporating 5-FU anion in the interlayer. Finally, the anticancer drug efficacy in vitro of the products was estimated by using the WST-8 assays in HeLa cell lines. As the result, the hollow nanosphere of the 5-FU/LDH performed an improvement of drug efficacy compared to the conventional plate-like particle of the 5-FU/LDH as the reference and the naked 5-FU itself at the same 5-FU concentration. Copyright 2022 Elsevier B.V., Amsterdam.All rights reserved.

    DOI

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Review Papers 【 display / non-display

  • Plating Technology for High-speed Transmission on Flexible Substrates Using the Molecular Bonding Method (i-SB method)

      73 ( 12 ) 776 - 780   2022.12

    In-House Magazine  

  • Observation of Interface between Rubber and Galvanized Steel Bonded with Direct Curing Adhesion system after Aging under Elevated Temperature and High Humidity.

      ( 16 ) 8 - 14   2012.03

    In-House Magazine  

Presentations 【 display / non-display

  • Study of adhesion between thermoplastic resin and metal using injection molding

    Poster (General) 

    2022.09
     
     

    Joint Meeting of the Tohoku Area Chemistry Societies

  • Study of adhesion between thermoplastic resin and metal using injection molding

    Poster (General) 

    2021.10
     
     

    Joint Meeting of the Tohoku Area Chemistry Societies

  • Study on etchingless plating on glass substrate by chemical bonding

    Poster (General) 

    2021.10
     
     

    Joint Meeting of the Tohoku Area Chemistry Societies

  • Synthesis of 1,3,5-triazine-based silane coupling agents containing diazirine- based photoreactive functional groups and their evaluation as molecular adhesive reagents

    Poster (General) 

    2021.10
     
     

    Joint Meeting of the Tohoku Area Chemistry Societies

  • Synthesis and particle-size control of anti-cancer drug intercalated layered double hydroxide by coprecipitation method

    Poster (General) 

    2021.10
     
     

    Joint Meeting of the Tohoku Area Chemistry Societies

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Academic Awards Received 【 display / non-display

  • 2022.09.18

  • 2022.09.17

  • 2021.10.03

  • 2021.09.17

  • 2017.09.16

    All winners: Hidetoshi Hirahara, Keisuke Takahashi, Sumio Aisawa, and Sang Jing

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Industrial Property 【 display / non-display

  • Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

    Patent

    Application number PCT/JP2015/075592 (国際出願日:2015/9/9)  Publication number WO2016/039375  Registration number 米国特許 10450439

    Application date: 2015.09.09

  • Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

    Patent

    Application number PCT/JP2015/075596 (国際出願日:2015/9/9)  Publication number WO2016/039376  Registration number 中国特許 201580048181.8

    Application date: 2015.09.09

    Publication date: 2016.03.01

  • Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

    Patent

    Application number PCT/JP2015/075592 (国際出願日:2015/9/9)  Publication number WO2016/039375  Registration number 欧州特許 3192830

    Application date: 2015.09.09

    Publication date: 2016.03.01

  • Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

    Patent

    Application number PCT/JP2015/075592 (国際出願日:2015/9/9)  Publication number WO2016/039375  Registration number 台湾特許 104129871

    Application date: 2015.09.09

  • Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

    Patent

    Application number PCT/JP2015/075596 (国際出願日:2015/9/9)  Publication number WO2016/039376  Registration number ブラジル出願番号: BR112017002573-6 号

    Application date: 2015.09.09

    Publication date: 2015.09.09

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Association Memberships 【 display / non-display

  • 2020.05
     
     
     

    The Japan Institute of Electronics Packaging