Research Interests 【 display / non-display 】

Research Interests 【 display / non-display 】

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Graduating School 【 display / non-display 】

Graduating School 【 display / non-display 】

• 　

  -

  1985.03

  Iwate University   Faculty of Engineering   Other

Degree 【 display / non-display 】

Degree 【 display / non-display 】

• Yamagata University -  Doctor (Engineering)  1998.03

Campus Career 【 display / non-display 】

Campus Career 【 display / non-display 】

• 2020.04

  -

  Now

  IWATE University   Center for Hiraizumi Studies   [Concurrently]

• 2024.04

  -

  Now

  IWATE University   Faculty of Science and Engineering   Department of Chemistry and Biological Science   Studies in Chemistry   Professor   [Concurrently]

• 2018.04

  -

  2020.03

  IWATE University   Center for Hiraizumi Studies   [Concurrently]

• 2016.04

  -

  Now

  IWATE University   Faculty of Science and Engineering   Department of Chemistry and Biological Science   Studies in Chemistry   Professor   [Duty]

• 2016.04

  -

  Now

  IWATE University   Abolition organization   Organization of Revitalization for Sanriku-region and regional development   Professor   [Concurrently]

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Research Areas 【 display / non-display 】

Research Areas 【 display / non-display 】

• Nanotechnology/Materials / Analytical chemistry

• Adhesion

• Nanotechnology/Materials / Nano/micro-systems

• Polymer chemistry

• Nanotechnology/Materials / Organic functional materials

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Course Subject 【 display / non-display 】

Course Subject 【 display / non-display 】

• 2004

  Seminar in Chemical Engineering

• 2004

  Chemical Engineering Laboratory Ⅰ

• 2004

  Chemical Engineering Exercise Ⅰ

• 2004

  Information for Chemistry

• 2004

  Industrial Analytical Chemistry

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Research Career 【 display / non-display 】

Research Career 【 display / non-display 】

• Research and development of innovative manufacture using molecular adhesion technology

  Periods of research：

  2014.06

  -

  2019.03

  Keywords : JUNCTION ADHESION SIP

  Style of Research： Collaboration in Japan

  Research Program： Research for Technical Practical Use Promotion of Leading  

  Contents of Research Career

  In the wide fields of industries such as vehicles, airplanes, semiconductor electrical equipments, medical equipment etc., the development of novel composite materials are in great competition now. The adhesion technology of different materials is becoming increasingly important.
  IWATE University has developed the method named molecule adhesion technology by triazine derivative which has the advantages such as material, condition and environment independence. It can be proposed as a new manufacture technology to realize fewer components and processes integration.
  With the advancement and diffusing of this technology promoting, the development can be performed for creating plenty of new functional products. The East-Japan post-earthquake rehabilitation and the innovation of manufacture of Japan will be expected.

• Intercalation of Triazinethiol Molecules into Layered Double Hydroxide and Their Crosslinking Property for Halogenated Rubber Intercalation of Triazinethiol Molecules into Layered Double Hydroxide and Their Crosslinking Property for Halogenated Rubber Intercalation of Triazinethiol Molecules into Layered Double Hydroxide and Their Crosslinking Property for Halogenated Rubber

  Periods of research：

  1999.04

  -

  Now

  Keywords : Layered double hydroxide

  Research Program： (not selected)  

• DISSIMILAR METALS JUNCTION and ADHESION

  Periods of research：

  1994.04

  -

  Now

  Keywords : JUNCTION and ADHESION

  Style of Research： Collaboration in Japan

  Research Program： The Other Research Programs  

• New triazine thiols compound synehesis

  Periods of research：

  1992.04

  -

  Now

  Keywords : triazine thiol

  Style of Research： Collaboration in Japan

  Research Program： (not selected)  

• Direct adhesion between Metal and Rubber

  Periods of research：

  1992.04

  -

  Now

  Keywords : metal,rubber,adhesion

  Style of Research： Individual

  Research Program： (not selected)  

Published Papers 【 display / non-display 】

Published Papers 【 display / non-display 】

• Catalytic mechanism of Co-containing layered double hydroxide (Co-LDH) as a precursor in carbon nanotube (CNT) synthesis

  Chika Chida, Sumio Aisawa, Kei Yokoyama, Riku Kumagai, Jing Sang, Hidetoshi Hirahara, Hiroe Kimura, Don N Futaba

  Chemistry Letters ( Oxford University Press )   53 ( 4 ) 1 - 5   2024.03  [Refereed]

  Bulletin of University, Institute, etc.  Single Work

• COPRECIPITATION OF BORON WITH NICKEL(II) HYDROXIDES IN WASTEWATER

  Sumio Aisawa, Masatoshi Takahashi, Tooru Abe, Chika Chida, Hidetoshi Hirahara, Eiichi Narit

  Clay Science ( ( 日本粘土学会 ) )  27 ( 3-4 ) 33 - 39   2023.12

  Academic Journal  Single Work

  In this work, the removal of boron (B) in wastewater was investigated by the coprecipitation method using bivalent metal ion as a precipitant. From the preliminary experiments conducted under the fundamental conditions, the removal percentage (coprecipitation degree) of B was found to be quite different depend on the kind of metal ions used, and it became the highest as 95.9% when Ni2+ ion was adopted. Also, the residual B concentration was under the limited value (10 mg/L) of the regulation for wastewater. Then, the optimum conditions in this case were studied in detail and the result was as follows; Initial B concentration=300 mg/L, Ni2+/B molar ratio=12/1, temperature 25°C and pH 9–10. Comparing with the Ni–Al layered double hydroxide prepared under the same condition, this nickel hydroxide precipitate indicated much higher removal ability for B. The precipitate obtained at the optimum condition was mainly the layered nickel hydroxide coordinating borate ion in the interlayer space, which basal spacing being 0.80 nm. Depending on the conditions, several other precipitates such as nickel hydroxide hydrate (3Ni(OH)2·2H2O) and theophrastite (Ni(OH)2) formed highly accompanying borate ion on their surface or inside. In conclusion, new simple method for the B removal by the coprecipitation using Ni2+ ion at higher pH was proposed in this study.

• Synthesis of phenylalanine and tartaric acid intercalated layered double hydroxide (LDH): Investigation of two kinds of chiral molecules interaction in interlayer space of LDH using solid-state vibrational circular dichroism

  Sumio Aisawa, Chika Chida, Honoka Ida, Jing Sang, Hidetoshi Hirahara, Hisako Sato

  Applied Clay Science ( Elsevier B.V. )   244   2023.11  [Refereed]

  Bulletin of University, Institute, etc.  Multiple authorship

  Recently, the applicability of solid-state vibrational circular dichroism (SD-VCD) for the evaluation of organoclay nanohybrids has attracted much attention. Herein, the intercalation of two kinds of chiral molecules, phenylalanine (Phe) and tartaric acid (Tart), into Zn-Al layered double hydroxide (LDH) was carried out by a standard coprecipitation method. The Phe/Tart/LDH was characterized by XRD, FT-IR, TG-DTA, and SD-VCD. The chemical composition and interlayer distance expansion of Phe/Tart/LDH indicated that Phe and Tart were intercalated into the LDH. The VCD and theoretical calculation results showed that Phe and Tart coexisted in the same interlayer space of LDH with the formation of electrostatic interaction and hydrogen bonding between Phe-Tart, LDH-Phe, and LDH-Tart. The results demonstrated the utility of the SD-VCD method for determining the detailed conformation of chiral molecules in the LDH interlayer space.

  DOI

• Submicrometer analyses of the polymer flow modifier effects on metal–polymer direct joining

  Shuohan Wang, Fuminobu Kimura, Weiyan Chen, Jing Sang, Hidetoshi Hirahara, Yusuke Kajihara

  Materials Letters   347 ( 134655 )   2023.09  [Refereed]

  Bulletin of University, Institute, etc.  Multiple authorship

  Polymer modification is a promising approach to improve the joining performance of injection molded direct joining (IMDJ) technology. However, the factors contributing to the improved joining strength of submicron scale surface pattern joints have not been fully elucidated. In this study, we investigated the mechanism for improving the joining performance of polyamide 6 (PA6)/aluminum alloy A5052 joints with Blast + hot water treated metal structure using a flow modifier (OSGOL MF-11). Enhanced mechanical polymer infiltration at the submicron scale was confirmed, and the hydrogen bond generation at the joint interface was characterized. These findings elucidate the reason for the joining performance improvement caused by the flow modifier in the submicron scale.

• Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

  Zhao Shuaijie, Chen Chuantong, Haga Motoharu, Ueshima Minoru , Suzuki Hirose , Takenaka Hiroto , Hirahara Hidetoshi , Sang Jing , Suganuma Katsuaki

  Microelectronics Reliability   149 ( 115211 )   2023.08  [Refereed]

  Bulletin of University, Institute, etc.  Multiple authorship

  The need for power modules has been promoted by the emergence of electric vehicles. The requirements of small volume, high integrity, and high reliability for the next-generation power module lead to the change of encapsulation method from previous gel encapsulation to epoxy encapsulation. Efforts have been made to enhance epoxy materials, and commercialized high-end epoxy has shown excellent properties, but power module failures still exist. The possible reason may lie in the interfacial interaction between encapsulation epoxy and substrate, which is less noticed previously. This paper seeks to unveil the influence of interfacial interaction on the bonding reliability between encapsulation epoxy and copper substrate. Three reliability tests were performed:
  high-temperature storage test (HST), temperature cycling test (TCT), and pressure cooker test (PCT). The bonding strength after these reliability tests was evaluated, and the bonding interface and fracture surface were analyzed in a nanoscale. Our study discovered that interfacial interaction plays a vital role in encapsulation reliability. Copper can diffuse into the epoxy and catalyze epoxy thermal oxidative degradation, which results in bonding strength reduction after HST and PCT. The surface structure change caused by copper oxidation after HST and PCT also reduced the bonding strength. These findings will greatly benefit future power module design.

  DOI

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Review Papers 【 display / non-display 】

Review Papers 【 display / non-display 】

• Chemical Interaction at the Interface of Metal-Resin Bonding

    73 ( 9 ) 776 - 780   2023.09

  Academic Journal  

• Plating Technology for High-speed Transmission on Flexible Substrates Using the Molecular Bonding Method (i-SB method)

    73 ( 12 ) 776 - 780   2022.12

  In-House Magazine  

• Observation of Interface between Rubber and Galvanized Steel Bonded with Direct Curing Adhesion system after Aging under Elevated Temperature and High Humidity.

    ( 16 ) 8 - 14   2012.03

  In-House Magazine  

Presentations 【 display / non-display 】

Presentations 【 display / non-display 】

• Study of adhesion between thermoplastic resin and metal using injection molding

  Poster (General) 

  2022.09

  　

  　

  Joint Meeting of the Tohoku Area Chemistry Societies

• Study of adhesion between thermoplastic resin and metal using injection molding

  Poster (General) 

  2021.10

  　

  　

  Joint Meeting of the Tohoku Area Chemistry Societies

• Study on etchingless plating on glass substrate by chemical bonding

  Poster (General) 

  2021.10

  　

  　

  Joint Meeting of the Tohoku Area Chemistry Societies

• Synthesis of 1,3,5-triazine-based silane coupling agents containing diazirine- based photoreactive functional groups and their evaluation as molecular adhesive reagents

  Poster (General) 

  2021.10

  　

  　

  Joint Meeting of the Tohoku Area Chemistry Societies

• Synthesis and particle-size control of anti-cancer drug intercalated layered double hydroxide by coprecipitation method

  Poster (General) 

  2021.10

  　

  　

  Joint Meeting of the Tohoku Area Chemistry Societies

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Academic Awards Received 【 display / non-display 】

Academic Awards Received 【 display / non-display 】

• 2023.11.03

• 2023.09.27

• 2023.09.10

• 2022.09.18

• 2022.09.17

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Industrial Property 【 display / non-display 】

Industrial Property 【 display / non-display 】

• Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

  Patent

  Application number PCT/JP2015/075592　（国際出願日：2015/9/9）  Publication number WO2016/039375  Registration number 米国特許　10450439

  Application date： 2015.09.09

• Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

  Patent

  Application number PCT/JP2015/075592　（国際出願日：2015/9/9）  Publication number WO2016/039375  Registration number 台湾特許 104129871

  Application date： 2015.09.09

• Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

  Patent

  Application number PCT/JP2015/075592　（国際出願日：2015/9/9）  Publication number WO2016/039375  Registration number 欧州特許 3192830

  Application date： 2015.09.09

  Publication date： 2016.03.01

• Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

  Patent

  Application number PCT/JP2015/075596　（国際出願日：2015/9/9）  Publication number WO2016/039376  Registration number 中国特許 201580048181.8

  Application date： 2015.09.09

  Publication date： 2016.03.01

• Rubber-Metal adhesion Promoter, Rubber Composition, and Tire

  Patent

  Application number PCT/JP2015/075596　（国際出願日：2015/9/9）  Publication number WO2016/039376  Registration number ブラジル出願番号：　BR112017002573-6 号

  Application date： 2015.09.09

  Publication date： 2015.09.09

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Association Memberships 【 display / non-display 】

Association Memberships 【 display / non-display 】

• 2020.05

  　

  　

   

  The Japan Institute of Electronics Packaging